Associate Professor
Campus Box 427
Ph: (303) 492-3393
Fax: (303) 492-3498

Research Interests

• Electronic / Optoelectronic Packaging
• solder self-alignment for precision alignments
• solder joint reliability
• thermosonic flip-chip bonding
• process control using fuzzy logic modeling techniques.
• Microelectromechanical systems (MEMS)
• Mechanical Computers

Teaching interest

• Component Design
• Mechatronics
• Engineering Projects
• Micromechanical Design and Analysis
• Electronic Packaging

• Prof. Y. C. Lee's Research Group
• CU MEMS research

Please visit my personal website for further details